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Semitronics

VALUE ADDED SERVICES

Semitronics provides the following services:

CUSTOM TESTING CAPABILITIES:

  • Static Burn-In
  • Dynamic Burn-In
  • Design Analysis
  • Electrical Testing/Screening
  • Pind Testing
  • Fine/Gross Leak
  • Radiography
  • Stabilization Bake
  • Humidity Testing
  • Temperature Cycling
  • Destruct Physical Analysis
  • Radiation Effects Analysis
  • Resistance to Solvents
  • Circuit Analysis
  • Vacuum Bake
  • SEM/EDX Analysis
  • Failure Analysis
  • Thermal Shock
  • Lead Integrity
  • Solderability Die Shear
  • Constant Acceleration
  • High-Temp Reverse Bias
  • Reliability Demonstration Testing
  • Bond Strength
  • Internal Water Vapor
  • Mechanical Shock
  • Environmental Stress Screening
  • Construction Analysis
  • QCI – Groups A, B, C, D, E
  • Variable/Attribute Data
  • Micro-probing
  • Salt Spray
  • Physical Dimensions
  • Residual Gas Analysis
  • Diffusion Analysis
  • Wire Bonding

VALUE ADDED TESTING

Product can be supplied to the standard MIL / STX and STXV Levels - as listed below, or to your custom requirements as outlined within our Value Added Services, and Quality Assurance Levels.

TEST DESCRIPTION QUALITY ASSURANCE LEVELS
MIL STX STXV
INTERNAL VISUAL (PRE-CAP) INSPECTION ✔
TEMPERATURE CYCLING
(Method 1051
Condition G 10 cycles)
 ✔ ✔ ✔
CONSTANT ACCELERATION for wire bond devices(Method 2006 10k G's Y1 Axis only) ✔ ✔ ✔
PRE-BURN IN ELECTRICAL TEST ✔ ✔ ✔
HIGH TEMPERATURE REVERSE BIAS (Burn-in)
Transistors = Method 1039 Cond. A
FETS = Method 1042 Cond. B
Diodes = Method 1038 Cond. A
SCR's = Method 1040
✔ ✔ ✔
FINAL ELECTRICAL PARAMETER (DC-100%) ✔ ✔ ✔
HERMETIC SEAL(FINE & GROSS LEAK) for Cavity Devices (Method 1071) ✔ ✔ ✔
Group A(Static Parameters @25°C) ✔ ✔
Group B Solderability Without Aging (Method 2026) ✔ ✔
Group B Resistance to Solvents (Method 1022) ✔ ✔